... Electronic Components & Technology Conference. Electronic Components & Technology Conference
Published by IEEE
United States · 3D IC and TSV technologies
Journal at a glance
- ISSN
- 2766-8401 (electronic)
- Publisher
- IEEE
- Country
- United States
- Language
- en
Also known as: Electron Compon Technol Conf (Abbreviation), Electronic Components and Technology Conference (Alternate title), ECTC (Alternate title), Proceedings (Alternate title), Electronic Components & Technology Conference (Alternate title)
Metrics
| Metric | Value | Year | Source |
|---|
| Works (OpenAlex) | 369 | 2026 | OpenAlex |
| h-index (OpenAlex) | 22 | 2026 | OpenAlex |
| i10-index (OpenAlex) | 88 | 2026 | OpenAlex |
| 2-year mean citedness (OpenAlex) | 0 | 2026 | OpenAlex |
| Citations (OpenAlex) | 2748 | 2026 | OpenAlex |
Subjects
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Copper Interconnects and Reliability
- Microwave Engineering and Waveguides
- Additive Manufacturing and 3D Printing Technologies
- Semiconductor materials and devices
Similar journals
- Microelectronics and reliability — United Kingdom · — · Same subject: 3D IC and TSV technologies, Same subject: Electronic Packaging and Soldering Technologies, 3 shared subjects in total
- Journal of vacuum science & technology. A, Vacuum, surfaces, and films : an official journal of the American Vacuum Society — United States · — · Same subject: Copper Interconnects and Reliability, Same subject: Semiconductor materials and devices
- Microelectronic engineering — Kingdom of the Netherlands · — · Same subject: Copper Interconnects and Reliability, Same subject: Semiconductor materials and devices
- IEEE transactions on device and materials reliability : a publication of the IEEE Electron Devices Society and the IEEE Reliability Society — United States · — · Same subject: Electronic Packaging and Soldering Technologies, Same subject: Semiconductor materials and devices
- Active and Passive Electronic Components — Kingdom of the Netherlands · Open access · Same subject: Copper Interconnects and Reliability, Same subject: Semiconductor materials and devices
- Facta Universitatis. Series: Electronics and Energetics — Serbia · Open access · Same subject: Microwave Engineering and Waveguides, Same subject: Semiconductor materials and devices
Sources: NLM Catalog, OpenAlex