IEEE transactions on components, packaging, and manufacturing technology
Published by IEEE
United States · Electronic Packaging and Soldering Technologies
Journal at a glance
- ISSN
- 2156-3950, 2156-3985 (electronic)
- Publisher
- IEEE
- Country
- United States
- Language
- en
Also known as: IEEE Trans Compon Packaging Manuf Technol (Abbreviation), Components, packaging, and manufacturing technology, IEEE transactions on (Alternate title), T-CPMT (Alternate title)
Metrics
| Metric | Value | Year | Source |
|---|
| h-index (OpenAlex) | 78 | 2026 | OpenAlex |
| DOIs registered (Crossref) | 5148 | 2026 | Crossref |
| DOIs, current year (Crossref) | 1053 | 2026 | Crossref |
| Works (OpenAlex) | 5238 | 2026 | OpenAlex |
| Citations (OpenAlex) | 63096 | 2026 | OpenAlex |
| i10-index (OpenAlex) | 1900 | 2026 | OpenAlex |
| 2-year mean citedness (OpenAlex) | 2.732 | 2026 | OpenAlex |
Subjects
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Microwave Engineering and Waveguides
- Electromagnetic Compatibility and Noise Suppression
- Advanced Antenna and Metasurface Technologies
- Silicon Carbide Semiconductor Technologies
- Heat Transfer and Optimization
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Sources: OpenAlex, NLM Catalog, Crossref · Last verified 2026-09-07