Journal of electronic packaging

Published by ASME International

United States · Electronic Packaging and Soldering Technologies

Journal at a glance

ISSN

1043-7398, 1528-9044 (electronic)

Publisher

ASME International

Country

United States

Language

en

Also known as: J Electron Packag (Abbreviation)

Metrics

Subjects

• Electronic Packaging and Soldering Technologies
• Heat Transfer and Optimization
• 3D IC and TSV technologies
• Heat Transfer and Boiling Studies
• Heat Transfer Mechanisms
• Adhesion, Friction, and Surface Interactions
• Mechanical Behavior of Composites

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• IEEE transactions on components, packaging, and manufacturing technology — United States · — · Same subject: 3D IC and TSV technologies, Same subject: Electronic Packaging and Soldering Technologies, 3 shared subjects in total, Same country
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Sources: OpenAlex, NLM Catalog, Crossref · Last verified 2026-09-07

Journal homepage